|
Nashua, NH, January 29, 2008 – Amphenol TCS, the leading provider of high performance
backplane interconnect systems today introduced a stacking version of its successful XCede® connector
platform. The XCede Stacker will enable parallel board to board designs with the same high levels of
performance and reliability as the XCede backplane system.
Stacking connectors provide equipment manufacturers the means to incorporate flexible
configurations into their card and system designs. The 4-pair size provides the density and mechanical
robustness necessary to address increasing I/O counts. The modular construction of the XCede stacker
with different guidance options allows the connector length to be optimized for each application. Several
heights are currently available, from 22mm up to 44 mm, making the connector ideal for scaling stackable
systems based on 1U increments.
The XCede connector is designed to enable future data rate requirements for datacom, telecom,
storage and wireless equipment, meeting and exceeding standards set for Ethernet, SONET/SDH, PCIe,
Fibre Channel and Infiniband among others, while employing a highly reliable press-fit attachment. An
innovative 3D shield technology enables very low crosstalk and incorporates advanced materials to prevent
high frequency resonances. This level of electrical performance and design flexibility allows equipment
manufacturers to reliably meet today’s data rates and easily implement performance upgrades in the future,
as higher performing silicon becomes available .
“We introduced the XCede connector to the market in early 2007 and it has proven to be very
successful in meeting the requirements of a broad range of markets,” said Andreas Pfahnl, ProductStacking Version of Amphenol TCS XCede® Connector Platform Now Available 2/2
Strategy and Development Manager for Amphenol TCS. “Customers emphasized the need for headroom in
today’s packaging to deliver even more bandwidth down the road without the need for costly and timeconsuming
re-design. The XCede Stacker now gives our customers this same performance headroom for
their mezzanine card applications.”
The XCede connector platform provides the mechanical longevity and ruggedness required by
today’s systems. Wide backplane module shield contacts feature a stiffness-enhancing rib and are
advanced well ahead of the signals for “drag your finger across” robustness. The XCede family also
supports 2-Pair (27.5 differential pairs/inch) through 6-Pair (82 differential pairs/inch) backplane connector
versions and integrated power and guidance.
Pricing and Availability
Amphenol TCS XCede connector family is available at approximately $0.10 - $0.16 per mated signal line in
full production volumes.
About Amphenol TCS
Amphenol TCS (ATCS) is a division of Amphenol Corporation. Amphenol TCS is the leader in high-speed,
high-density connection systems, designing and manufacturing the industry's leading high-speed, highdensity
connectors and backplane systems for application in the networking, communications, storage, and
computer markets. Amphenol Corporation is one of the world's leading producers of electronic and fiber
optic connectors, cable and interconnect systems. For more information, visit www.amphenol-tcs.com.
|
