Here you will find our Cross Reference Guide. Select your device manufacturer, application, and device name to easily locate a corresponding ET Accessory.
EdmondMarks Technologies is a full service Electronic Manufacturing Services (EMS) provider with full turnkey capabilities. Services include SMT,BGA,uBGA,FPT,Flip Chip and PTH thru hole technologies. Full in-house PCB design and Test capabilities.
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Hand Tools, Ball Grid Array (BGA) Placement Systems, Electrical Box Builds, Environmental Chamber Rent, Semi Automatic Lathes, Printed Circuit Board (PCB) Assembly, Printed Circuit Board (PCB) Design, Through Hole Relays, Wire Strippers, Testing, Through Hole Assembly, Automatic Optical Inspection (AOI), In Line Fans, Ball Grid Arrays (BGA) available from AMTECH Electrocircuits based in Royal Oak, MI. Click the links below to visit our website or contact us via our profile page.
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PCB Design using Pads PowerPCB, Pcad and Orcad. Come to us for: Schematic Capture, Prototype and Production Boards, Design for Manufacturability, Design for Test, Analog/Digital Design, RF Design, Hand Routing, MIL Spec, LTCC Multi-Chip Module, Multi-Layer, Multi-Sided, ICT, BGA, Flex.
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Dynatex International manufactures semiconductor dicing equipment and materials
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Through Hole Assembly, Ball Grid Arrays (BGA) available from Esmi Inc based in San Diego, CA. Click the links below to visit our website or contact us via our profile page.
Pin Grid Arrays (PGA), Flip Chip Bumping, Thin Small Outline Packages (TSOP), Ball Grid Arrays (BGA) available from GigaTest based in Sunnyvale, CA. Click the links below to visit our website or contact us via our profile page.
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Thin Small Outline Packages (TSOP), Ball Grid Arrays (BGA) available from Green Forest Technologies Ltd based in . Click the links below to visit our website or contact us via our profile page.
IC Insights, Inc., based in Scottsdale, Arizona, is dedicated to providing high-quality, cost-effective market research for the integrated circuit industry. Founded in October 1997, IC Insights offers coverage of global economic trends, the IC market forecast, capital spending and fab capacity trends, product market details, and technology trends, as well as complete IC company profiles and evaluations of emerging markets for ICs.
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SAE International is a consortium of eight corporations that have the manufacturing capabilities to support the electro-mechanical hardware sector and electronic manufactoring sectors.
Instrumentation, Computer Hardware, Packaging Products, Computer Services, Packaging Materials, Computer Network Equipment, Electronic Display Panels or Modules or Systems, Amplifiers, Business Internet Services, Cable and Wire, Business and Office Machines and Equipment, Test and Measurement Instrumentation, Electrical and Electronic Instrumentation, Moisture Analyzers, Caps, Central Processing Units (CPU), Citizens Band (CB) Radios, Computer Integrated Manufacturing (CIM) Systems, Computer Aided Computer Software Engineering, Control Systems available from Techlearner based in . Click the links below to visit our website or contact us via our profile page.
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Computer Hardware, Computer Network Equipment, Modems, Multichip Modules, Plastic Leaded Chip Carriers (PLCC), Pin Grid Array (PGA) Sockets, Surface Mounted Sockets, Dual In Line Package (DIP) Relays, Double Data Rate (DDR) Memory Modules, Set Top Box Cables, Personal Digital Video Recorders (DVR), High Definition Televisions (HDTV), Digital Multimedia Players, Ball Grid Arrays (BGA), Thin Quad Flat Packages (TQFP), Thin Shrink Small Outline Packages (TSSOP) available from TLSI Inc based in Huntington, NY. Click the links below to visit our website or contact us via our profile page.
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Ball Grid Arrays (BGA) available from Unitechno based in Cupertino, CA. Click the links below to visit our website or contact us via our profile page.
Central Processing Unit (CPU) Coolers, Heat Sinks, Bonded Fin Heat Sinks, Microprocessor Units, Extruded Heat Sinks, Ball Grid Arrays (BGA) available from A division of T-Tech Machine based in Warwick, RI. Click the links below to visit our website or contact us via our profile page.
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Multichip Modules, Flip Chip Bumping, Ball Grid Arrays (BGA) available from Advanced Component Labs based in Santa Clara, California. Click the links below to visit our website or contact us via our profile page.
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Computer Services, Business Internet Services, Computer Hardware Design and Development, Computer Hardware Design, Fiber Optics, Web Site Design or Creation Services, Ball Grid Arrays (BGA) available from Allayer Communications based in San Jose, CA. Click the links below to visit our website or contact us via our profile page.
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Semiconductor Technology at cavium Networks. Specializing in multicore networking and communication processors
Kyocera is supplying Flat type printheads, Corner Edge type printheads and True Edge type printheads which can fulfill all the market application requirements.
Engineering Services, Surface Mounted (SM) Assembly or Component Production Equipment, Business Process Consultancy, Electrical and Electronic Thermal Management Products, Electronic Component Procurement, Manufacturing Services, Product Support Engineering, Surface Mount Technology (SMT) Placement Systems, Thermal Management Materials, Quality Assurance Auditing, Functional Testing Systems, Liquid Process Design, Awards, Ball Grid Arrays (BGA) available from Contract Manufacturing based in Austin, Texas. Click the links below to visit our website or contact us via our profile page.
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JTAG Boundary-Scan Test Products, JTAG emulation, and ISP from Corelis
Vicor corporation designs and manufactures dc-dc converters, ac-dc converters, ac and dc power supplies, military cots power supplies, and custom power conversion products and systems.
Mnemonics inc is a leading supplier of defense electronic systems, network centric warfare products, intelligence gathering, technical services and contract electronic manufacturing
The entry page to CTS`s Web site. Featuring Passive, Electromechanical, Hybrid & Interconnect Components for OEM`s.
The entry page to CTS`s Web site. Featuring Passive, Electromechanical, Hybrid & Interconnect Components for OEM`s.
Data Device Corporation: Supplier of MIL-STD-1553 Data Bus Interfaces, ARINC 429 Data Bus Interfaces, Synchro/Resolver data conversion, Motor Drives and Power Controls, and Commercial off the shelf (COTS).
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Stansard devices stocked in DEI's warehouse for sale.
Thin Small Outline Packages (TSOP), Accelerated Graphics Port (AGP) Video Graphics Array (VGA) Cards, Double Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM), PC133 Synchronous Dynamic Random Access Memory (SDRAM), Biotechnology Products, Smart Card Design, Ball Grid Arrays (BGA), Computer Peripheral Equipment, Information Technology (IT) Consultancy, Central Processing Units (CPU), Mobile Computing Systems, Dynamic Random Access Memory (DRAM), Erasable Programable Read Only Memories (EPROM), Heat Sink Fans, Compact Flash (CF) Disks, Personal Computer (PC) Card Frames, Flash Memory, Synchronous Dynamic Random Access Memory (SDRAM), Synchronous Graphics Random Access Memory (SGRAM), Random Access Memory (RAM) available from Electec Norcal based in Santa Clara, CA. Click the links below to visit our website or contact us via our profile page.
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Market research in computer, communications, and semiconductor technologies
Electronic Cable Assemblies or Harnesses, Batteries, Direct Current (DC) to Direct Current (DC) Converters, Loudspeakers, Power Cords, Magnetic Therapy Products, Delay Lines, Ball Grid Arrays (BGA) available from Fahrner-Miller Associates based in Santa Clara, CA. Click the links below to visit our website or contact us via our profile page.
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