Hybond Inc. www.hybond.com
Company Overview
Hybond manufactures and sells Ultrasonic Wire Bonders, Ultrasonic Peg Bonders, Semi-Automatic Eutectic & Laser Diode Die Bonders, Semi-Automatic Epoxy & silver Glass Die Bonders, DFS Bonder Test Systems, & Custom Workstages, die attach machines, insulated wire bonders, dynamic force measurement machines, and specialized equipment for unique assembly requirements. Our line of equipment includes both manual and semiautomatic capabilities and is oriented towards companies whose applications do not require high speed, high cost automatic equipment.
Contact Details
| Address: | 330 State PL., Escondido, California (CA), 92029-1364, USA |
| Tel: | 760-746-7105 |
| Fax: | 760-746-1408 |
| Web: | www.hybond.comEscondido companies |
Products by this company
We found 39 results
Bonding
Chip Scale Package (CSP) Bonding Equipment
Conductive Strip Electromagnetic Interference Shielding (EMS) Wire Bonded Meshes
Die Bonding Equipment
Flip Chip Bonding Equipment
Fusion Bonded Multilayer Microwave Printed Circuits
Grounding, Bonding, Aluminum
High Temperature Resistant Semiconductor Manufacturing Equipment
* Hybond
Mechanical Components
Multichip Module Semiconductor Assembly Equipment
Precision Components
Precision Machined Components
Semiconductor Assembly Equipment
Semiconductor Die Attach Equipment
Semiconductor Die Attaching
Semiconductor Interconnect Packaging Products
Semiconductor Interconnect Products
Semiconductor Manufacturing Equipment Components
Semiconductor Manufacturing Equipment Maintenance or Repair
Semiconductor Manufacturing Support Services
Semiconductor Process Equipment
Semiconductor Tape Automated Bonding (TAB) Equipment
Semiconductor Technology Bonding Wire
Semiconductor Wafer Bonding Systems
Semiconductor Wire Bonding Equipment
Semiconductors Production Machinery or Equipment Retrofitting
Tape Automated Bonding (TAB)
Tape Automated Bonding (TAB) Accessories
Wire Bonding
* Trade or brand name
